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? 2002-2012 microchip technology inc. preliminary ds21370d-page 1 tc1232 features ? precision voltage monitor - adjustable +4.5v or +4.75v ? reset pulse width ? 250 msec minimum ? no external components ? adjustable watchdog timer - 150 msec, 600 msec or 1.2 sec ? operating voltage 4.0v to 5.5v ? debounced manual reset input for external override block diagram general description the tc1232 is a fully-integrated processor supervisor that provides three important functions to safeguard processor sanity: precision power on/off reset control, watchdog timer and external reset override. on power-up, the tc1232 holds the processor in the reset state for a minimum of 250 msec after v cc is within tolerance to ensure a stable system start-up. microprocessor sanity is monitored by the onboard watchdog circuit. the microprocessor must provide a periodic low-going signal on the st input. should the processor fail to supply this signal within the selected time-out period (150 msec, 600 msec or 1200 msec), an out-of-control processor is indicated and the tc1232 issues a processor reset as a result. the outputs of the tc1232 are immediately driven active when the pb input is brought low by an external push button switch or other electronic signal. when connected to a push button switch, the tc1232 provides contact debounce. the tc1232 is packaged in a space-saving 8-pin pdip or soic package, a 16-pin soic (wide) package and requires no external components. package types device features + ? v ref + + ? rst rst to l e r a n c e select (5% or 10%) tol v cc debounce watchdog timebase select pb rst td watchdog timer s t reset generator device rst pin rst pin trip points (max) minimum reset active time (ms) wdi input typical timeouts (ms) mr input type pull-up resistor active level type active level tc1232 open-drain external low push-pull high 4.75v or 4.5v 250 150, 600 or 1200 yes 13 12 11 10 9 15 14 18 27 36 4 5 tc1232 rst rst gnd tol td pb rst rst st v cc rst st 18 27 36 45 rst gnd tol td pb rst rst st v cc pb rst vcc 1 2 3 4 5 6 7 8 16 nc td nc nc tol gnd nc nc nc tc1232 nc nc 16-pin soic (wide) 8-pin pdip 8-pin soic tc1232 18 36 45 tc1232 microprocessor monitor
tc1232 ds21370d-page 2 preliminary ? 2002-2012 microchip technology inc. 1.0 electrical characteristics absolute maximum ratings? voltage on any pin (with respect to gnd) ...................................................... -0.3v to +5.8v operating temperature range: c-version ........................................ 0c to +70c e-version......................................-40c to +85c storage temperature range: ............-65c to +150c ? stresses above those listed under "absolute maximum ratings" may cause permanent damage to the device. these are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the specifications is not implied. exposure to absolute maximum rating conditions for extended periods may affect device reliability. dc characteristics electrical specifications: unless otherwise noted, t a = t min to t max ; v cc = +4.0v to 5.5v. parameters sym min typ max units conditions supply voltage v cc 4.0 5.0 5.5 v st and pb rst input high level v ih 2.0 ? v cc +0.3 v note 1 st and pb rst input low level v il -0.3 ? +0.8 v input leakage st , tol i l -1.0 ? +1.0 a output current rst i oh -1.0 -12 ? ma v oh = 2.4v current rst, rst i ol 2.0 10 ? ma v ol = 0.4v operating current i cc ? 50 200 a note 2 v cc 5% trip point v cctp 4.50 4.62 4.74 v tol = gnd (note 3) v cc 10% trip point v cctp 4.25 4.37 4.49 v tol = v cc (note 3) capacitance electrical characteristics: unless otherwise noted, t a = +25c . (note 4) input capacitance st , tol c in ?? 5 pf output capacitance rst, rst c out ?? 7 pf note 1: pb rst is internally pulled up to v cc with an internal impedance of typically 40 k ? . 2: measured with outputs open. 3: all voltages referenced to gnd. 4: ensured by design.
? 2002-2012 microchip technology inc. preliminary ds21370d-page 3 tc1232 figure 1-1: rise time, fall time and reset detected to reset active timing waveforms. ac characteristics electrical specifications: unless otherwise noted, t a = t min to t max ; v cc = +4.0v to 5.5v. parameters sym min typ max units conditions v cc fall time t f 10 ? ? s note 1 v cc rise time t r 0? ?s note 1 v cc trip point detected to rst high and rst low t rpd ? ? 100 ns v cc falling v cc trip point detected to rst high and rst open t rpu 250 610 1000 ms v cc rising (note 2) note 1: ensured by design. 2: t r = 5 s. +4.75v t f v cc +4.25v t r v cc +4.25v +4.75v v cc = 5v +4.5v (5% trip point) +4.25v (10% trip point) rst rst v ol v oh t rpd v cc 4.6v (5% trip point) 4.5v(10% trip point) rst rst v ol v oh t rpu determined by external pull-up resistor determined by external pull-up resistor
tc1232 ds21370d-page 4 preliminary ? 2002-2012 microchip technology inc. figure 1-2: push button reset and watchdog timer reset timing waveforms. ac characteristics (continued) electrical specifications: unless otherwise noted, t a = t min to t max ; v cc = +4.0v to 5.5v. parameters sym min typ max units conditions pb rst pulse width t pb 20 ? ? ms note 1 pb rst falling edge low to reset active t pbd 14 20ms pb rst rising edge high to reset inactive t rst 250 610 1000 ms st pulse width t st 20 ? ? ns st time-out period t td 62.5 150 250 ms td pin = 0v 250 600 1000 ms td pin = open 500 1200 2000 ms td pin = v cc note 1: p b r st must be held low for a minimum of 20 ms to ensure a reset. rst v il t pb rst t pbd v ih t rst pb rst the debounced pb rst input ignores input pulses less than 1 ms and is designed to recognize pulses of 20 ms or greater. t st st t td rst (when t td ? t td (min)) ?h? rst (when t td (min) ? t td ? t td (max)) (when t td ? t td (max)) rst rst (when t td ? t td (min)) ?l? rst (when t td (min) ? t td ? t td (max)) (when t td ? t td (max)) rst
? 2002-2012 microchip technology inc. preliminary ds21370d-page 5 tc1232 2.0 typical performance curves performance graphs are not available.
tc1232 ds21370d-page 6 preliminary ? 2002-2012 microchip technology inc. 3.0 pin descriptions the descriptions of the pins are listed in table 3-1. table 3-1: pin function tables pin no. symbol pin type buffer/ driver type function 8-pin pdip, soic 16-pin soic 1 2 pb rst i st push-button reset input. input for a manual reset switch. this input debounces (ignores) pulses less than 1 ms in duration and is ensured to recognize inputs of 20 ms or greater. l = manual reset switch is active, force rst/rst pins active h = manual reset switch is inactive. state of rst/rst pins determined by other system conditions. 2 4 td i st time delay input. the voltage level on this input determines the watchdog timer time-out period. td = 0v ? t td = 150 ms td = open ? t td = 600 ms td = v cc ? t td = 1.2 sec 3 6 tol i st tolerance input. tol = gnd, max voltage trip point (v cctp ) = 4.75v (5% tolerance) tol = v cc , max voltage trip point (v cctp ) = 4.5v (10% tolerance) 4 8 gnd ? p the ground reference for the device. 59rstopush pull reset output (active-high) goes active (high) if one of these conditions occurs: 1. if v cc falls below the selected reset voltage threshold. 2. if pb rst pin is forced low. 3. if st pin is not strobed within the minimum selected time-out period. (see td pin) 4. during power-up 611rst o open drain reset output (active-low) goes active (low) if one of these conditions occurs: 1. if v cc falls below the selected reset voltage threshold. 2. if pb rst pin is forced low. 3. if st pin is not strobed within the minimum selected time-out period. (see td pin) 4. during power-up 713 st i st strobe input input for watchdog timer. wdt period determined by state of td pin falling edge ? resets watchdog timer counter (no time-out) 815v cc ? p the positive supply (+5v) for the device. ? 1,3,5, 7,10,1 2,16 nc ? ? no internal connection.
? 2002-2012 microchip technology inc. preliminary ds21370d-page 7 tc1232 4.0 operational description 4.1 power monitor the tc1232 provides the function of warning the processor of a power failure. when v cc is detected as being below the voltage levels defined by the tol pin, the tc1232?s comparator outputs the rst and rst signals to a logic level that warns the system of an out- of-tolerance power supply. the rst and rst signals switch at a threshold value of 4.5v if tol is tied to v cc , and at a value of 4.75 volts if tol is grounded. the rst and rst signals are held active for a minimum of 250 ms to ensure that the power supply voltage has been stabilized. figure 4-1 shows the v cc fall time. figure 4-2 shows the v cc rise time. figure 4-3 shows the time from when the voltage trip point is detected to the reset output pin going active. figure 4-4 shows the time from when the voltage trip point is exited to the reset output pin going inactive. figure 4-1: power-down slew rate. figure 4-2: power-up slew rate. figure 4-3: v cc detect reset output delay (power-down). figure 4-4: v cc detect reset output delay (power-up). +4.75v t f v cc +4.25v t r v cc +4.25v +4.75v v cc = 5v +4.5v (5% trip point) +4.25v (10% trip point) rst rst v ol v oh t rpd v cc slew rate = 1.66 mv/s (0.5v/300 s) v cc 4.6v (5% trip point) 4.5v(10% trip point) rst rst v ol v oh t rpu
tc1232 ds21370d-page 8 preliminary ? 2002-2012 microchip technology inc. 4.2 push button reset input the debounced manual reset input (pb rst ) manually forces the reset outputs into their active states. figure 4-5 shows a block diagram for using the tc1232 with a push button switch. once pb rst has been low for a time t pbd (the push- button delay time), the reset outputs go active. the reset outputs remain in their active states for a minimum of 250 ms after pb rst rises above v ih . figure 4-6 shows a waveform for the push button switch input and the reset pins output. a mechanical push button or active logic signal can drive the pb rst input. the debounced input ignores input pulses less than 1 ms and recognizes pulses of 20 ms or greater. no external pull-up resistor is required because the pb rst input has an internal pull-up to v cc of approximately 100 a. figure 4-5: push button reset and watchdog timer. figure 4-6: push button reset ? pb rst input. v cc tol pb rst gnd rst st i/o reset +5v tc1232 td microprocessor rst v il t pb rst t pbd v ih t rst pb rst the debounced pb rst input ignores input pulses less than 1 ms and is designed to recognize pulses of 20 ms or greater.
? 2002-2012 microchip technology inc. preliminary ds21370d-page 9 tc1232 4.3 watchdog timer when the st input is not stimulated for a preset time period, the watchdog timer function forces rst and rst signals to the active state. the preset time period is determined by the td inputs to be 150 ms with td connected to ground, 600 ms with td floating or 1200 ms with td connected to v cc (typ.). the watchdog timer starts timing-out from the set time period as soon as rst and rst are inactive. if a high- to-low transition occurs on the st input pin prior to time-out, the watchdog timer is reset and begins to time-out again. if the watchdog timer is allowed to time- out, the rst and rst signals are driven to the active state for 250 ms, minimum (figure 4-7). the software routine that strobes st is critical. the code must be in a section of software that is executed frequently enough so the time between toggles is less than the watchdog time-out period. one common technique controls the microprocessor i/o line from two sections of the program. the software might set the i/o line high while operating in the foreground mode and set it low while in the background or interrupt modes. if both modes do not execute correctly, the watchdog timer issues reset pulses. t td is the maximum elapsed time between st high-to- low transitions (st is activated by falling edges only), which will keep the watchdog timer from forcing the reset outputs active for a time of t rst . t td is a function of the voltage at the td pin, as tabulated below: table 4-1: watchdog timer periods figure 4-7 shows a block diagram for using the tc1232 with a picmicro ? mcu and the watchdog input. figure 4-7: watchdog timer. figure 4-8 shows the expected reset output pin wave- forms depending on the period of the st pin falling edge and the state of the td input pin. figure 4-8: strobe input. 4.4 supply monitor noise sensitivity the tc1232 is optimized for fast response to negative- going changes in v dd . systems with an inordinate amount of electrical noise on v dd (such as systems using relays) may require a 0.01 f or 0.1 f bypass capacitor to reduce detection sensitivity. this capacitor should be installed as close to the tc1232 as possible to keep the capacitor lead length short. condition t td min typ max td pin = 0v 62.5 ms 150 ms 250 ms td pin = open 250 ms 600 ms 1000 ms td pin = vcc 500 ms 1200 ms 2000 ms v cc tol gnd rst st reset +5v tc1232 td 0.1 10 k ? i/o picmicro ? 3-terminal regulator +5v f mcu (example: mcp1700 ) t st st t td rst (when t td ? t td (min)) ?h? rst (when t td (min) ? t td ? t td (max)) (when t td ? t td (max)) rst rst (when t td ? t td (min)) ?l? rst (when t td (min) ? t td ? t td (max)) (when t td ? t td (max)) rst
tc1232 ds21370d-page 10 preliminary ? 2002-2012 microchip technology inc. 5.0 packaging information 5.1 package marking information xxxxxxxx xxxxxnnn yyww 8-lead pdip (300 mil) examples: 8-lead soic (150 mil) examples: xxxxxxxx xxxxyyww nnn tc1232 i/p256 0518 tc1232 coa0518 256 16-lead soic (150 mil) examples: xxxxxxxxxxxxx yywwnnn xxxxxxxxxxxxx tc1232 coe 0518256 xxxxxxxxxx legend: xx...x customer-specific information y year code (last digit of calendar year) yy year code (last 2 digits of calendar year) ww week code (week of january 1 is week ?01?) nnn alphanumeric traceability code pb-free jedec designator for matte tin (sn) * this package is pb-free. the pb-free jedec designator ( ) can be found on the outer packaging for this package. note : in the event the full microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. 3 e 3 e tc1232 cpa^^256 0518 tc1232e oa^^0518 256 tc1232 coe^^ 0518256 xxxxxxxxxx or or or 3 e 3 e 3 e
? 2002-2012 microchip technology inc. preliminary ds21370d-page 11 tc1232 8-lead plastic dual in-line (pa) ? 300 mil (pdip) b1 b a1 a l a2 p ? e eb ? c e1 n d 1 2 units inches* millimeters dimension limits min nom max min nom max number of pins n 88 pitch p .100 2.54 top to seating plane a .140 .155 .170 3.56 3.94 4.32 molded package thickness a2 .115 .130 .145 2.92 3.30 3.68 base to seating plane a1 .015 0.38 shoulder to shoulder width e .300 .313 .325 7.62 7.94 8.26 molded package width e1 .240 .250 .260 6.10 6.35 6.60 overall length d .360 .373 .385 9.14 9.46 9.78 tip to seating plane l .125 .130 .135 3.18 3.30 3.43 lead thickness c .008 .012 .015 0.20 0.29 0.38 upper lead width b1 .045 .058 .070 1.14 1.46 1.78 lower lead width b .014 .018 .022 0.36 0.46 0.56 overall row spacing eb .310 .370 .430 7.87 9.40 10.92 mold draft angle top ? 51015 51015 mold draft angle bottom ? 51015 51015 * controlling parameter notes : dimensions d and e1 do not include mold flash or protrusions. mold flash or protrusions shall not exceed jedec equivalent: ms-001 drawing no. c04-018 .010? (0.254mm) per side. significant characteristic note: for the most current package drawings, please see the microchip packaging specification located at http://www.microchip.com/packaging
tc1232 ds21370d-page 12 preliminary ? 2002-2012 microchip technology inc. 8-lead plastic small outline (oa) ? narrow, 150 mil (soic) foot angle ? 048048 15 12 0 15 12 0 ? mold draft angle bottom 15 12 0 15 12 0 ? mold draft angle top 0.51 0.42 0.33 .020 .017 .013 b lead width 0.25 0.23 0.20 .010 .009 .008 c lead thickness 0.76 0.62 0.48 .030 .025 .019 l foot length 0.51 0.38 0.25 .020 .015 .010 h chamfer distance 5.00 4.90 4.80 .197 .193 .189 d overall length 3.99 3.91 3.71 .157 .154 .146 e1 molded package width 6.20 6.02 5.79 .244 .237 .228 e overall width 0.25 0.18 0.10 .010 .007 .004 a1 standoff 1.55 1.42 1.32 .061 .056 .052 a2 molded package thickness 1.75 1.55 1.35 .069 .061 .053 a overall height 1.27 .050 p pitch 8 8 n number of pins max nom min max nom min dimension limits millimeters inches* units 2 1 d n p b e e1 h l ? c 45 ? ? a2 ? a a1 * controlling parameter notes: dimensions d and e1 do not include mold flash or protrusions. mold flash or protrusions shall not exceed .010? (0.254mm) per side. jedec equivalent: ms-012 drawing no. c04-057 significant characteristic note: for the most current package drawings, please see the microchip packaging specification located at http://www.microchip.com/packaging
? 2002-2012 microchip technology inc. preliminary ds21370d-page 13 tc1232 16-lead plastic small outline (oe) ? wide, 300 mil (soic) foot angle ? 048048 15 12 0 15 12 0 ? mold draft angle bottom 15 12 0 15 12 0 ? mold draft angle top 0.51 0.42 0.36 .020 .017 .014 b lead width 0.33 0.28 0.23 .013 .011 .009 c lead thickness 1.27 0.84 0.41 .050 .033 .016 l foot length 0.74 0.50 0.25 .029 .020 .010 h chamfer distance 10.49 10.30 10.10 .413 .406 .398 d overall length 7.59 7.49 7.39 .299 .295 .291 e1 molded package width 10.67 10.34 10.01 .420 .407 .394 e overall width 0.30 0.20 0.10 .012 .008 .004 a1 standoff 2.39 2.31 2.24 .094 .091 .088 a2 molded package thickness 2.64 2.50 2.36 .104 .099 .093 a overall height 1.27 .050 p pitch 16 16 n number of pins max nom min max nom min dimension limits millimeters inches* units l ? c ? h 45 ? 1 2 d p n b e1 e ? a2 a1 a * controlling parameter notes: dimensions d and e1 do not include mold flash or protrusions. mold flash or protrusions shall not exceed .010? (0.254mm) per side. jedec equivalent: ms-013 drawing no. c04-102 significant characteristic note: for the most current package drawings, please see the microchip packaging specification located at http://www.microchip.com/packaging
tc1232 ds21370d-page 14 preliminary ? 2002-2012 microchip technology inc. notes:
? 2002-2012 microchip technology inc. preliminary ds21370d-page 15 tc1232 appendix a: revision history revision d (november 2012) ? added a note to the package outline drawing. revision c (june 2005) the following is the list of modifications: 1. since no data is given in section 2.0 ?typical performance curves? , ?preliminary? was added to the bottom of this document. 2. corrected operating voltage in the electrical specifications 3. general data sheet enhancements 4. added revision history appendix section revision b (march 2003) ? not logged revision a (march 2002) ? original release of this document.
tc1232 ds21370d-page 16 lpreliminary ? 2002-2012 microchip technology inc. notes:
? 2002-2012 microchip technology inc. preliminary ds21370d-page 17 tc1232 product identification system to order or obtain information, e. g., on pricing or delivery, refer to the factory or the listed sales office . device: tc1232: microprocessor monitor temperature range: c = 0c to +70c e = -40c to +85c package: pa = plastic dip (300 mil body), 8-lead oa = plastic soic, (150 mil body), 8-lead oa713 = plastic soic, (150 mil body), 8-lead tape and reel oe = plastic soic (300 mil body), 16-lead oe713 = plastic soic (300 mil body), 16-lead tape and reel part no. x /xx package temperature range device examples: a) tc1232coa: 0c to +70c, 8l-soic b) TC1232COA713: 0c to +70c, 8l-soic, tape and reel c) tc1232coe: 0c to +70c, 16l-soic d) tc1232coe713: 0c to +70c, 16l-soic tape and reel e) tc1232cpa: 0c to +70c, 8l-pdip f) tc1232eoa: -40c to +85c, 8l-soic g) tc1232eoa713: -40c to +85c, 8l-soic, tape and reel h) tc1232eoe: -40c to +85c, 16l-soic i) tc1232eoe713: -40c to +85c, 16l-soic, tape and reel j) tc1232epa: -40c to +85c, 8l-pdip
tc1232 ds21370d-page 18 preliminary ? 2002-2012 microchip technology inc. notes:
? 2002-2012 microchip technology inc. preliminary ds21370c-page 19 information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. it is your responsibility to ensure that your application meets with your specifications. microchip makes no representations or warranties of any kind whether express or implied, written or oral, statutory or otherwise, related to the information, including but not limited to its condition, quality, performance, merchantability or fitness for purpose . microchip disclaims all liability arising from this information and its use. use of microchip devices in life support and/or safety applications is entirely at the buyer?s risk, and the buyer agrees to defend, indemnify and hold harmless microchip from any and all damages, claims, suits, or expenses resulting from such use. no licenses are conveyed, implicitly or otherwise, under any microchip intellectual property rights. trademarks the microchip name and logo, the microchip logo, dspic, flashflex, k ee l oq , k ee l oq logo, mplab, pic, picmicro, picstart, pic 32 logo, rfpic, sst, sst logo, superflash and uni/o are registered trademarks of microchip technology incorporated in the u.s.a. and other countries. filterlab, hampshire, hi-tech c, linear active thermistor, mtp, seeval and the embedded control solutions company are registered trademarks of microchip technology incorporated in the u.s.a. silicon storage technology is a registered trademark of microchip technology inc. in other countries. analog-for-the-digital age, app lication maestro, bodycom, chipkit, chipkit logo, codeguard, dspicdem, dspicdem.net, dspicworks, dsspeak, ecan, economonitor, fansense, hi-tide, in-circuit serial programming, icsp, mindi, miwi, mpasm, mpf, mplab certified logo, mplib, mplink, mtouch, omniscient code generation, picc, picc-18, picdem, picdem.net, pickit, pictail, real ice, rflab, select mode, sqi, serial quad i/o, total endurance, tsharc, uniwindriver, wiperlock, zena and z-scale are trademarks of microchip technology incorporated in the u.s.a. and other countries. sqtp is a service mark of microchip technology incorporated in the u.s.a. gestic and ulpp are registered trademarks of microchip technology germany ii gmbh & co. & kg, a subsidiary of microchip technology inc., in other countries. all other trademarks mentioned herein are property of their respective companies. ? 2002-2012, microchip technology incorporated, printed in the u.s.a., all rights reserved. printed on recycled paper. isbn: 9781620767467 note the following details of the code protection feature on microchip devices: ? microchip products meet the specification cont ained in their particular microchip data sheet. ? microchip believes that its family of products is one of the most secure families of its kind on the market today, when used i n the intended manner and under normal conditions. ? there are dishonest and possibly illegal methods used to breach the code protection feature. all of these methods, to our knowledge, require using the microchip produc ts in a manner outside the operating specif ications contained in microchip?s data sheets. most likely, the person doing so is engaged in theft of intellectual property. ? microchip is willing to work with the customer who is concerned about the integrity of their code. ? neither microchip nor any other semiconduc tor manufacturer can guarantee the security of their code. code protection does not mean that we are guaranteeing the product as ?unbreakable.? code protection is constantly evolving. we at microchip are co mmitted to continuously improvin g the code protection features of our products. attempts to break microchip?s code protection feature may be a violation of the digital millennium copyright act. if such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that act. microchip received iso/ts-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in chandler and tempe, arizona; gresham, oregon and design centers in california and india. the company?s quality system processes and procedures are for its pic ? mcus and dspic ? dscs, k ee l oq ? code hopping devices, serial eeproms, microperipherals, nonvolatile memory and analog products. in addition, microchip?s quality system for the design and manufacture of development systems is iso 9001:2000 certified. quality management s ystem certified by dnv == iso/ts 16949 ==
ds21370c-page 20 preliminary ? 2002-2012 microchip technology inc. americas corporate office 2355 west chandler blvd. chandler, az 85224-6199 tel: 480-792-7200 fax: 480-792-7277 technical support: http://www.microchip.com/ support web address: www.microchip.com atlanta duluth, ga tel: 678-957-9614 fax: 678-957-1455 boston westborough, ma tel: 774-760-0087 fax: 774-760-0088 chicago itasca, il tel: 630-285-0071 fax: 630-285-0075 cleveland independence, oh tel: 216-447-0464 fax: 216-447-0643 dallas addison, tx tel: 972-818-7423 fax: 972-818-2924 detroit farmington hills, mi tel: 248-538-2250 fax: 248-538-2260 indianapolis noblesville, in tel: 317-773-8323 fax: 317-773-5453 los angeles mission viejo, ca tel: 949-462-9523 fax: 949-462-9608 santa clara santa clara, ca tel: 408-961-6444 fax: 408-961-6445 toronto mississauga, ontario, canada tel: 905-673-0699 fax: 905-673-6509 asia/pacific asia pacific office suites 3707-14, 37th floor tower 6, the gateway harbour city, kowloon hong kong tel: 852-2401-1200 fax: 852-2401-3431 australia - sydney tel: 61-2-9868-6733 fax: 61-2-9868-6755 china - beijing tel: 86-10-8569-7000 fax: 86-10-8528-2104 china - chengdu tel: 86-28-8665-5511 fax: 86-28-8665-7889 china - chongqing tel: 86-23-8980-9588 fax: 86-23-8980-9500 china - hangzhou tel: 86-571-2819-3187 fax: 86-571-2819-3189 china - hong kong sar tel: 852-2401-1200 fax: 852-2401-3431 china - nanjing tel: 86-25-8473-2460 fax: 86-25-8473-2470 china - qingdao tel: 86-532-8502-7355 fax: 86-532-8502-7205 china - shanghai tel: 86-21-5407-5533 fax: 86-21-5407-5066 china - shenyang tel: 86-24-2334-2829 fax: 86-24-2334-2393 china - shenzhen tel: 86-755-8203-2660 fax: 86-755-8203-1760 china - wuhan tel: 86-27-5980-5300 fax: 86-27-5980-5118 china - xian tel: 86-29-8833-7252 fax: 86-29-8833-7256 china - xiamen tel: 86-592-2388138 fax: 86-592-2388130 china - zhuhai tel: 86-756-3210040 fax: 86-756-3210049 asia/pacific india - bangalore tel: 91-80-3090-4444 fax: 91-80-3090-4123 india - new delhi tel: 91-11-4160-8631 fax: 91-11-4160-8632 india - pune tel: 91-20-2566-1512 fax: 91-20-2566-1513 japan - osaka tel: 81-66-152-7160 fax: 81-66-152-9310 japan - yokohama tel: 81-45-471- 6166 fax: 81-45-471-6122 korea - daegu tel: 82-53-744-4301 fax: 82-53-744-4302 korea - seoul tel: 82-2-554-7200 fax: 82-2-558-5932 or 82-2-558-5934 malaysia - kuala lumpur tel: 60-3-6201-9857 fax: 60-3-6201-9859 malaysia - penang tel: 60-4-227-8870 fax: 60-4-227-4068 philippines - manila tel: 63-2-634-9065 fax: 63-2-634-9069 singapore tel: 65-6334-8870 fax: 65-6334-8850 taiwan - hsin chu tel: 886-3-5778-366 fax: 886-3-5770-955 taiwan - kaohsiung tel: 886-7-213-7828 fax: 886-7-330-9305 taiwan - taipei tel: 886-2-2508-8600 fax: 886-2-2508-0102 thailand - bangkok tel: 66-2-694-1351 fax: 66-2-694-1350 europe austria - wels tel: 43-7242-2244-39 fax: 43-7242-2244-393 denmark - copenhagen tel: 45-4450-2828 fax: 45-4485-2829 france - paris tel: 33-1-69-53-63-20 fax: 33-1-69-30-90-79 germany - munich tel: 49-89-627-144-0 fax: 49-89-627-144-44 italy - milan tel: 39-0331-742611 fax: 39-0331-466781 netherlands - drunen tel: 31-416-690399 fax: 31-416-690340 spain - madrid tel: 34-91-708-08-90 fax: 34-91-708-08-91 uk - wokingham tel: 44-118-921-5869 fax: 44-118-921-5820 worldwide sales and service 10/26/12

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